Interconnect manufacturers deliver new connectors and cable assemblies with higher reliability and ruggedness for harsh ...

The wireless industry is in the midst of a shift toward a more sophisticated phase of 5G with 5G-Advanced, representing a new ...

SiFive introduces its second-generation RISC-V IP with enhanced scalar, vector, and matrix processing capabilities for AI ...

Melexis introduces a new online tool that addresses the challenges of selecting non-contact FIR temperature sensors.

Rohde & Schwarz’s new BBA series of broadband amplifiers delivers higher field strengths for critical test environments up to ...

Infineon launches a software portfolio for the latest AURIX TC4x MCUs, enabling automotive safety and security applications.

Bourns’ SE Series of thermal cutoff mini-breakers meets the 240-W USB power delivery standard, delivering overtemperature ...

TDK’s B41699 and B41799 series of aluminum electrolytic capacitors offer high capacitance and high ripple current in a ...

ST announces 20-year availability for its SPC58 automotive MCUs with seven product lines, targeting a range of automotive applications.

Microchip Technology's GNSS disciplined oscillator modules target defense applications in GNSS-denied environments.

Vishay’s MKP1848e DC-link film capacitor operates up to 125°C and withstands Grade III temperature humidity bias testing.

Renesas introduces ultra-low-power RL78/L23 MCUs with segment LCD displays and capacitive touch for HMI applications in smart ...