Advanced film adhesives and pastes, which cure under pressure and temperature, are now replacing ... laboratories to co-develop next-generation bonding solutions. The result is an expanding catalog of ...

The biggest issue is that, at a certain point, bonding strength ceases to matter. In the case of both PVA and epoxy, the wood ...

Engineers at Rice University are developing next-generation wearable devices that are smarter, lighter weight and more ...

The global silicone in heavy machinery market size was valued at $1.2 billion in 2019, and is projected to reach $1.9 billion by 2027, growing at a CAGR of 5.5% from 2020 to 2027. Silicone is a ...

The North America and Asia-Pacific silicone in heavy machinery market size was valued at $0.8 billion in 2019, and is projected to reach $1.2 billion by 2027, growing at a CAGR of 5.6% from 2020 to ...

Researchers from the University of Tokyo propose cooling chips using microchannels built into the chips themselves. The ...

We’ve all been there—trying to peel a boiled egg, but mangling it beyond all recognition as the hard shell stubbornly sticks ...

Manufacturers are turning to automation, AI, and robotics to boost repeatability, cut costs, and support heterogeneous ...

The DSC test was conducted over the temperature range of 0.3 °C to ... leading to inferior bonding properties. (29) In our adhesive’s catalyst-free curing process, high temperatures cause itaconic ...