Joint Development Agreement builds on ongoing collaboration with Manz Asia MANCHESTER, England, July 9, 2025 /PRNewswire/ -- Smartkem (Nasdaq: SMTK), ...

The emerging wafer-level packaging (WLP) technology suffers from serious signal integrity (SI) and power integrity (PI) issues due to its redistribution layer (RDL). There exhibit serious parasitic ...

Even if polymers are used for decades in electronics and microelectronics, one of the primary drawbacks is their susceptibility to moisture uptake. Moisture penetrating into polymers reduces their ...