Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports: Summary The semiconductor industry will initiate 18 new fab construction projects in 2025, focusing on ...
CES 2025 kicked off in Las Vegas with insights on human-centric tech innovation, AI integration, and shifting demographics. CTA's Brian Comiskey highlighted key trends: digital coexistence, human ...
Koh Young’s approach focuses on empowering manufacturers to optimize every stage of production, ensuring consistency, quality ...
Global Semiconductor Sales Increase 20.7% Year-to-Year in November: Summary Global semiconductor sales soared to $57.8 billion in November 2024, marking a 20.7% year-over-year sur ...
Summary Broadcom unveiled its 3.5D XDSiP™ platform, combining TSMC's CoWoS packaging and 3D silicon stacking for next-gen AI accelerators. Supporting up to 6000mm² SiPs with 12 HBM modules, it targets ...
Bangladesh’s semiconductor industry shows promising growth potential, focusing on VLSI design despite lacking large-scale fabrication facilities. With talent, strategic investment, and initiatives ...
Summary MediaTek and Nvidia are collaborating on the GB10 Grace Blackwell superchip for Project Digits, the world’s smallest AI supercomputer. Targeting AI researchers and students, the chip aims to ...
Summary Professor Xiao Su and his team at the University of Illinois have developed a nanofiltration process to remove toxic PFAS chemicals from semiconductor manufacturing. Despite interest from ...
Researchers globally advanced technology with innovative breakthroughs. A Hong Kong-led team developed a groundbreaking aluminum gallium nitride deep-UV microLED display for maskless lithography, ...
The prominent trends we're seeing for 2025 revolve around meeting sustainability demands and keeping equipment cost of ...
NAMICS Corporation remains committed to environmental stewardship, dedicated to producing high-quality, eco-friendly ...
Summary Through-silicon vias (TSVs) boost speed and efficiency in 2.5D/3D chip packaging, shrinking devices for AR/VR and biomedical uses. Despite cost hurdles, TSV advancements and backside power ...
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